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单词 bonders
释义

bonders

听听怎么读
是什么意思
  • n.压焊机;焊接器;〔建〕束石;丁砖
  • 网络本德斯
  • 变形

    复数:bonders
    学习怎么用

    词组短语

    die bonder芯片焊接机;模片结合器,裸片结合器

    wire bonder引线接合器;丝焊器

    双语例句

    1.
    havetwoSMTlines,twohand-paste,threeplug-inlines,threehigh-qualitytinafterthebailiffandawirebondersassemblyline.
    拥有两条SMT线、两条手贴线、三条插件线、三条高质量的执锡后焊线和一条装配线。
    www.tonke.cn
    2.
    Onlyinrarepairbonderslikehumanscanadultmatesusesimilarsubconsciouscuestosustaintheirromancesindefinitely.
    只有很少的配偶关系如人类,才会在成年伴侣间使用这种相似的潜意识来维持长期的浪漫关系。
    3.
    Theyalsoclaimthat"unlikerats,humans are pair bonders"butthisissimplynotthecase.
    该文作者还声称“与老鼠不同,人类是单配偶的”,但事实绝非如此。
    4.
    Portability Plus:Thesmallworldofhotbonders.
    便携式附件:热耦合器的小世界。
    www.lib.cafuc.edu.cn
    5.
    Nowadays outstanding wire-bondersareallautomaticand they are equippedwellwithmachine-visioneither.
    目前IC封装业的焊线机已全面自动化,同时也配备了机器视觉系统。
    www.ceps.com.tw
    6.
    Humans, on the other hand,areamongtheraremammals with the capacity to "fallinlove."We're pair bonders.
    另一方面,人类属于稀有的、有能力恋爱的哺乳动物,我们是需要联姻关系的。
    7.
    Industry:Wirebonders;Strippingmachine;Winding machines, stranding machines; Wirestrippingmachine;JumperMachine;TerminalMachine;
    所属行业:焊线机;剥线机;绕线机、绞线机;导线剥皮机;跳线机;端子机;;
    www.integrity-enterprises.net
    8.
    Industry:Electronicsmanufacturingequipment;SolderingStation;Otherelectricequipment;Wirebonders;Weldingrod;
    所属行业:电子产品制造设备;焊台;其他电热设备;焊线机;焊条;;
    www.integrity-enterprises.net
    9.
    Industry:Wirebonders;DispensingEquipment;JumperMachine;PressureWelder;Spotwelder;ElectronicsLine;
    所属行业:焊线机;点胶设备;跳线机;压焊机;点焊机;电子电器生产线;;
    www.integrity-enterprises.net
    10.
    Industry:ResistanceWeldingMachine; Energy storage machine;Spotwelder;Laserweldingmachine;Touchwelder;Wirebonders;
    所属行业:电阻焊机;储能机;点焊机;激光焊机;碰焊机;焊线机;;
    www.integrity-enterprises.net
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    权威例句

    Monitoring ultrasonic wire bonders with a dynamic signal analyzer
    Mechanism and control of linear positioning for IC wire bonders
    Women’s Voluntary Organizations in Canada: Bridgers, Bonders, or Both?
    Holographic Interferometry Applied to Motion Studies of Ultrasonic Bonders
    Method of self-correcting bond placement errors of integrated circuit bonders
    Application of flip-chip-bonders in AuSn solder processes to achieve high after bonding accuracy for optoelectronic modules
    Operating an effective resource allocation for wire bonders in the semiconductor assembly industry
    Development of non-destructive bond monitoring techniques for ultrasonic bonders
    A microslip model of the bonding process in ultrasonic wire bonders Part I: Transient response
    Dynamic characteristics of stacked piezoelectric transducers of ultrasonic wire bonders used in integrated circuit packaging
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