单词 | bonders |
释义 |
bonders听听怎么读
英
美
是什么意思 变形复数:bonders 学习怎么用 词组短语die bonder芯片焊接机;模片结合器,裸片结合器 wire bonder引线接合器;丝焊器 双语例句1. havetwoSMTlines,twohand-paste,threeplug-inlines,threehigh-qualitytinafterthebailiffandawirebondersassemblyline. 拥有两条SMT线、两条手贴线、三条插件线、三条高质量的执锡后焊线和一条装配线。 www.tonke.cn 2. Onlyinrarepairbonderslikehumanscanadultmatesusesimilarsubconsciouscuestosustaintheirromancesindefinitely. 只有很少的配偶关系如人类,才会在成年伴侣间使用这种相似的潜意识来维持长期的浪漫关系。 3. Theyalsoclaimthat"unlikerats,humans are pair bonders"butthisissimplynotthecase. 该文作者还声称“与老鼠不同,人类是单配偶的”,但事实绝非如此。 4. Portability Plus:Thesmallworldofhotbonders. 便携式附件:热耦合器的小世界。 www.lib.cafuc.edu.cn 5. Nowadays outstanding wire-bondersareallautomaticand they are equippedwellwithmachine-visioneither. 目前IC封装业的焊线机已全面自动化,同时也配备了机器视觉系统。 www.ceps.com.tw 6. Humans, on the other hand,areamongtheraremammals with the capacity to "fallinlove."We're pair bonders. 另一方面,人类属于稀有的、有能力恋爱的哺乳动物,我们是需要联姻关系的。 7. Industry:Wirebonders;Strippingmachine;Winding machines, stranding machines; Wirestrippingmachine;JumperMachine;TerminalMachine; 所属行业:焊线机;剥线机;绕线机、绞线机;导线剥皮机;跳线机;端子机;; www.integrity-enterprises.net 8. Industry:Electronicsmanufacturingequipment;SolderingStation;Otherelectricequipment;Wirebonders;Weldingrod; 所属行业:电子产品制造设备;焊台;其他电热设备;焊线机;焊条;; www.integrity-enterprises.net 9. Industry:Wirebonders;DispensingEquipment;JumperMachine;PressureWelder;Spotwelder;ElectronicsLine; 所属行业:焊线机;点胶设备;跳线机;压焊机;点焊机;电子电器生产线;; www.integrity-enterprises.net 10. Industry:ResistanceWeldingMachine; Energy storage machine;Spotwelder;Laserweldingmachine;Touchwelder;Wirebonders; 所属行业:电阻焊机;储能机;点焊机;激光焊机;碰焊机;焊线机;; www.integrity-enterprises.net
权威例句Monitoring ultrasonic wire bonders with a dynamic signal analyzerMechanism and control of linear positioning for IC wire bondersWomen’s Voluntary Organizations in Canada: Bridgers, Bonders, or Both?Holographic Interferometry Applied to Motion Studies of Ultrasonic BondersMethod of self-correcting bond placement errors of integrated circuit bondersApplication of flip-chip-bonders in AuSn solder processes to achieve high after bonding accuracy for optoelectronic modulesOperating an effective resource allocation for wire bonders in the semiconductor assembly industryDevelopment of non-destructive bond monitoring techniques for ultrasonic bondersA microslip model of the bonding process in ultrasonic wire bonders Part I: Transient responseDynamic characteristics of stacked piezoelectric transducers of ultrasonic wire bonders used in integrated circuit packaging
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