英语词汇“interposer”的意思、用法、释义、翻译、读音、例句、短语、词组-英语词典

是什么意思

释义

插入式选样；

英英释义

Interposer

integrated circuit die to ball grid array]]

以上来源于:Wikipedia

学习怎么用

权威例句

INTERPOSER
Interposer
Interposer
Wafer level interposer
TSV interposer fabrication for 3D IC packaging
Silicon interposer with TSVs (Through Silicon Vias) and fine multilayer wiring
Semiconductor chip assemblies having interposer and flexible lead
3-D Thin film interposer based on TGV (Through Glass Vias): An alternative to Si-interposer
Interposer design optimization for high frequency signal transmission in passive and active interposer using through silicon via (TSV)
Interposer design optimization for high frequency signal transmission in passive and active interposer using through silicon via (TSV)
Power Delivery Network Design for 3D SIP Integrated over Silicon Interposer Platform
Development of through silicon via (TSV) interposer technology for large die (21×21mm) fine-pitch Cu/low-k FCBGA package
Development of through silicon via (TSV) interposer technology for large die (21×21mm) fine-pitch Cu/low-k FCBGA package

单词	interposer
释义	interposer 听听怎么读英 [?nt?:'p??z?] 美 [?nt?'po?z?] 是什么意思释义插入式选样；英英释义 Interposer integrated circuit die to ball grid array]] 以上来源于:Wikipedia 学习怎么用权威例句 INTERPOSER Interposer Interposer Wafer level interposer TSV interposer fabrication for 3D IC packaging Silicon interposer with TSVs (Through Silicon Vias) and fine multilayer wiring Semiconductor chip assemblies having interposer and flexible lead 3-D Thin film interposer based on TGV (Through Glass Vias): An alternative to Si-interposer Interposer design optimization for high frequency signal transmission in passive and active interposer using through silicon via (TSV) Interposer design optimization for high frequency signal transmission in passive and active interposer using through silicon via (TSV) Power Delivery Network Design for 3D SIP Integrated over Silicon Interposer Platform Development of through silicon via (TSV) interposer technology for large die (21×21mm) fine-pitch Cu/low-k FCBGA package Development of through silicon via (TSV) interposer technology for large die (21×21mm) fine-pitch Cu/low-k FCBGA package
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